Merck, a leading science and technology company, today opened its new Metrology & Inspection site in Saint-Ismier, France. The €20 million, 4,500 m² site strengthens Merck’s capacity to develop and manufacture precise metrology and inspection tools to address the growing demands of the semiconductor industry for high-performance chips. This demand is driven by the rapid growth of AI applications. Strategically located in the Grenoble area, one of Europe’s most established semiconductor clusters, the site reinforces Merck’s role in building a more resilient and competitive European semiconductor ecosystem.
“Advancing chip performance increasingly relies on the intricate architecture of chip systems rather than solely on miniaturization. With chip designs becoming increasingly complex, even the smallest inconsistencies can jeopardize entire systems. This makes quality assurance and reliability more challenging than ever,” said Ben Hein, Member of the Executive Board of Merck and CEO Electronics. “Our expertise in metrology and inspection provides chip manufacturers with the precise tools and solutions they need to realize the next wave of technological advancements.”
Enabling next-generation semiconductor innovations
The new facility expands Merck’s production capacity for Metrology & Inspection tools fivefold. These solutions are becoming increasingly critical for ensuring accuracy and defect detection in chip production, supporting chip manufacturers in advanced packaging and heterogeneous integration. These 3D technologies for next-generation chip architectures bring memory and logic chips closer together through vertical stacking, enhancing performance while reducing energy consumption.
Metrology tools measure critical parameters in chip manufacturing such as depths, step heights, and thicknesses, enabling real-time adjustments that improve process control. Inspection tools detect a wide range of defect types, ensuring the highest quality standards. Together, these technologies enhance manufacturing yields, reduce production costs, and accelerate time-to-market for next-generation semiconductor innovations.
