SEATTLE — Amazon Web Services (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), today announced an expanded collaboration with NXP® Semiconductors to move a majority of NXP’s electronic design automation (EDA) to AWS. Building on a three-year collaboration with AWS, NXP will leverage the performance, scalability, and security of AWS to deliver semiconductor design implementation for automotive, IoT, mobile, and communication solutions.
NXP recently completed deploying its end-to-end semiconductor chip design on AWS. NXP established a cloud center of excellence (CCoE) to accelerate this migration, ensuring governance for cloud workloads, training its employees, and standardizing application development.
Leveraging AWS’s advanced global infrastructure capabilities in high performance computing, artificial intelligence and machine learning services, NXP recently executed a full system-on-a-chip design, including simulation and tape-out for their leading-edge vehicle integration processor.
“We are excited to expand our relationship with AWS to power the next generation of EDA workloads in the cloud. Leveraging AWS’s portfolio of cloud services has been instrumental in accelerating our semiconductor innovation development and production cycles,” said Adhir Mattu, CIO and senior vice president, NXP Semiconductors. “Our engineers can dynamically provision the compute they need, when they need it, to power our most demanding EDA workloads. This has boosted productivity and time-to-market for our cutting-edge products.”
“NXP is a pioneer in leveraging the cloud for cutting-edge semiconductor design and manufacturing,” said Nafea Bshara, vice president and distinguished engineer at AWS. “We are excited to expand our collaboration and help NXP push the boundaries of what’s possible using cloud and generative AI technologies to drive even greater efficiencies.”
